The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 1991
Filed:
Aug. 03, 1989
Hans Schmidt, Eurasburg, DE;
Siemens Aktiengesellschaft, Berlin and Munich, DE;
Abstract
A printed circuit board includes an injected molded substrate having a pattern recessed in the substance surface of interconnect traces, through-connections and connecting rods. A trench-shaped depression is provided in the substrate surface in the region of each interconnect trace, and a planar depression is provided in the substrate's surface in at least one of (a) the region of each through-connection and (b) the region of each contact surfacae. The pattern of recesses is covered with a conductive metal coat, and the depth of each planar depression is greater than the depth of each trench-shaped depression, so that the metal coat fills the trench-shaped depressions to the surface of the substrate, while in the planar depressions a distance remains between the metal coat and the surface of the substrate. A solder stop lacquer can then be applied such as by roller coating, without the necessity of photo-structuring and without filling the planar depressions.