The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 1991
Filed:
Jun. 09, 1988
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
A conductive composition comprising conductive particles made of a mechanical composite powder of copper or nickel covered with silver and a binder mainly containing bis-phenol A type epoxy resin (diglycidyl ether of bisphenol A) having 1600 to 5500 of molecular weight method for manufacturing a printed circuit substrate comprising the steps of printing the conductive composition on an insulating substrate and partially curing it in a range of 20 to 70% of completion as determined from DTA reactivity data. Thus, the conductive composition can manufacture an inexpensive circuit in simple steps as a whole with good solderability using low melting point solder and having high bonding strength. The method can manufacture the circuit by using the same conductive composition.