The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 1991
Filed:
Dec. 12, 1988
Joseph Wycech, Grosse Pointe Woods, MI (US);
Essex Composite Systems, Roseville, MI (US);
Abstract
A two-part for reinforcing a hollow strucutral members and its method of use are provided. A method of reinforcing a structural member having a hollow cavity comprises the steps of preparing a first dough which includes a thermal setting resin, a first filler and unexpanded, thermally-expandable microspheres. A further step includes preparing a second dough which includes a curing agent, a colorant and a second filler. The curing agent is compatible with the thermosetting resin to promoter cross-linking of the thermosetting resin upon contact with the curing agent. The hollow structural member may be preheated to enhance the rate at whcih the thermosetting resin cross-links. The two dough are blended together until a reactive third dough of substantially uniform mixture is formed. The uniformity of the blending is confirmed when the reactive third dough attains a uniform color intermediate the color between the colors of the first and second doughs. The blended reactive dough is then packed into the cavity of the cleaned structural member. The cavity is then preferably closed with a closure plate. As the curing agent promotes the cross-linking reaction of the thermosetting resin, the exothermic reaction generates heat which is transferred to the unexpanded, thermally-expandable microspheres, causing the microspheres to expand. The expansion of the microspheres causes the reactie dough to rise, substantially filling the cavity. As the reactive dough cures, it bonds rigidly to the surfaces whcih it contacts. The reactive dough is allowed to fully cure, whereupon a solid lightweight reinforcement member rigidly bonded to the structural member is formed.