The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 1991
Filed:
May. 17, 1988
Applicant:
Inventors:
Shunichi Uemura, Itami, JP;
Yashuhiro Murasawa, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 74 ; 357 75 ;
Abstract
Two types of semiconductor packages (6a, 6b), being different in direction of bending of external lead terminals (3) from each other, are prepared to be mounted on a single surface or both surfaces of a package substrate. In case of single-surface mounting, the external lead terminals (3) of the same pin numbers can be electrically connected with each other by drawing around wires (9). In case of double-surface mounting, the external lead terminals (3) of the same pin numbers can be electrically connected with each other by through holes.