The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 1991
Filed:
Nov. 15, 1989
Taketoshi Kaimasu, Toyota, JP;
Takayoshi Tsuzuki, Toyota, JP;
Aisin Seiki Kabushiki Kaisha, Kariya, JP;
Abstract
A process of nickel plating for forming a plated film having a high phosphorus content according to this invention comprises the steps of: a first step of electroless plating a substance to be plated in an electroless plating bath capable of forming an electroless plated film having a phosphorus content of from 0.20 to 0.25 in atomic ratio of phosphorus with respect to nickel taken as one (1); and a second step of electroplating the substance to be plated by applying an electric current having an electric current density of from 1 to 10 A/dm.sup.2, and the substance to be plated being left immersed in the electroless plating bath continuously, thereby laminating an electroplated film on the surface of the electroless plated film. The process of nickel plating can form a plated film having a remarkably improved wettability with respect to solders since the electroplated film is formed on the electroless plated film having the high phosphorus content. Further, the plated film maintains the good chemical resistance and abrasion resistance of the electroless plated film, and has strong adhesion endurable to the thermal stress and the mechanical stress of an actual service.