The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 1991

Filed:

May. 31, 1990
Applicant:
Inventors:

Wayne A Baus, Elyria, OH (US);

Frederick W Haushalter, Kenton, OH (US);

Assignee:

Aqua-Form Inc., Elyria, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B / ;
U.S. Cl.
CPC ...
62-364 ; 62394 ; 62396 ; 2221466 ;
Abstract

A method and apparatus adaptable for use with bottled water dispensing systems thermoelectrically cools the bottled water contained in a bottle which is positioned in a water receptacle within a housing. The bottled water cooling units include a heat sink having a plurality of fins, preferably of a corrugated configuration, secured to and extending outwardly from the first side of a base plate. At least one thermoelectric chip, being connectable to an electrical energy source and having a cold side and a hot side, is bonded to the second side of the base plate, wherein the cold side of the chip is in contact with the water receptacle to lower the temperature of the water contained in and flowing through the receptacle, and the hot side of the chip is in direct contact with the heat sink base plate. A fan is provided to circulate air through the plurality of fins of the heat sink. The cooling unit further includes a power supply capable of providing a current through the at least one thermoelectric chip, wherein the power supply is also preferably capable of converting 110 volts alternating current to 12 volts direct current. Finally, the cooling unit may include clamping means for clamping the heat sink and thermoelectric chip against the water receptacle to assure direct continued contact between the cold side of the at least one thermoelectric chip and the water receptacle.


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