The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 1991
Filed:
Jan. 06, 1989
Takahiko Arakawa, Hyogo, JP;
Kazuhiro Sakashita, Hyogo, JP;
Satoru Kishida, Hyogo, JP;
Toshiaki Hanibuchi, Hyogo, JP;
Ichiro Tomioka, Hyogo, JP;
Masahiro Ueda, Hyogo, JP;
Yoshihiro Okuno, Hyogo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
An internal logic gate portion (3) is provided in the central portion of a semiconductor chip (1), input/output buffers (4) are provided to surround the internal logic gate portion (3), and bonding pads (2) are provided in the peripheral portions of the semiconductor chip (1) corresponding to input/output buffer cells (5) in the input/output buffer. Each of the input/output buffer cells (5) comprises an output P-MOS portion (6), an output N-MOS portion (7), an input/logic P-MOS portion (8) and an input/logic N-MOS portion (9), which are respectively arranged in a single line in the direction from the bonding pads (2) to the internal logic gate portion (3). In the above described structure, the size of each of the input/output buffer cells (5) in the pad arranging direction of the bonding pads (2) is decreased, so that the number of input/output pins can be increased according to the decreased use of space in the pad arranging direction required by each input/output buffer cell (5).