The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 1991
Filed:
Sep. 28, 1989
Applicant:
Inventors:
Henry G Heck, Buhl, DE;
Warren D White, Lake Jackson, TX (US);
Assignee:
The Dow Chemical Company, Midland, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
264135 ; 264137 ; 264258 ; 264324 ;
Abstract
Preforms for molding processes such as resin transfer molding processes are prepared by melting a solid, non-sintering, thermoplastic-like resinous compound on the surface of a substrate material; after cooling, assembling one or more plies of the coated substrate material into the desired shape; heating the thus shaped substrate material to a temperature above the melting temperature of resinous compound and subsequently cooling to a temperature below the melting point of the resinous compound.