The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 1991
Filed:
Feb. 14, 1990
Randall K Frank, Scottsdale, AZ (US);
Motorola Inc., Schaumburg, IL (US);
Abstract
Very compact, low cost power semiconductor device modules suitable for use in variable speed motor controllers multiple solenoid drivers, and the like are provided by attaching pre-packaged (e.g., type TO-220) semiconductor devices by their heat dissipation surfaces to opposed planar faces of a metal heat conduction plate using an electrically insulating and thermally conductive epoxy. By proper choice of the heat conduction plate thickness and the device-to-device spacing thereon, the leads of the pre-packaged devices can be arranged to have, on the modules, the same lead-to-lead and row-to-row spacing as for common JEDEC DIL-IC packages so that the modules fit on a conventional package footprint when mounted on a circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile