The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 1991

Filed:

Aug. 30, 1989
Applicant:
Inventors:

Koichi Murakami, Yokosuka, JP;

Yukitsugu Hirota, Kamakura, JP;

Mikio Bessho, Amagasaki, JP;

Masahiro Tsugai, Amagasaki, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 26 ; 357 25 ; 357 55 ;
Abstract

A semiconductor acceleration sensor, including a semiconductor substrate, in which a mounting portion is formed in the substrate, and first and second cantilevered beams are formed in the substrate in opposite sides of the mounting portion so that these three members are aligned along a straight line, and in which a weight is formed at an end of the first cantilevered beam, and first and second strain sensing devices are formed in approximately the same layout in surface portions of the first and second cantilevered beams, respectively.


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