The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 1991
Filed:
Feb. 26, 1990
Tadashi Tanaka, Chiba, JP;
Kazuo Matsumura, Kanagawa, JP;
Hiroshi Komorita, Kanagawa, JP;
Nobuyuki Mizunoya, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, wherein the median surface roughness (R.sub.a) of the outer surface of the copper sheet is not greater than 3 .mu.m, and the maximum surface roughness (R.sub.max) of the outer surface of the copper sheet is not greater than 18 .mu.m. The invention improves the manufacturing reliability of various electronic devices such as semiconductor modules.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile