The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 1991
Filed:
Jun. 16, 1988
Applicant:
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P / ; F24F / ; H05K / ; H01L / ;
U.S. Cl.
CPC ...
29564 ; 29740 ; 981153 ; 437217 ;
Abstract
An apparatus for packaging semiconductor devices includes a die bonder, a wire bonder, and a molding unit wherein the die bonder, the wire bonder, and the molding unit are sequentially arranged for operation in an uninterrupted continuous sequence. To prevent semiconductor dies from being contaminated by the dust generated by the molding unit, the die bonder and wire bonder are covered by an air cleaner chamber including an air filter and air ventilator. Alternatively, the molding unit is covered by an air draft chamber including an air supply nozzle and an exhaust pipe which exhausts the dust generated by the molding unit.