The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 1991
Filed:
Apr. 22, 1987
Masakazu Uekita, Kobe, JP;
Hiroshi Awaji, Kobe, JP;
Kanegafuchi Kagaku Kogyo Kabushiki Kaisha, Osaka, JP;
Abstract
A copolymeric amphiphilic polyimide precursor having the recurring unit of the formula (1): ##STR1## wherein R.sup.1 is a tetravalent group having at least 2 carbon atoms, R.sup.2 is a bivalent group having at least 2 carbon atoms, and R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are hydrogen atom or a monovalent group having 1 to 30 carbon atoms selected from the group consisting of an aliphatic group, an alicyclic group, an aromatic group, a group in which an aliphatic group is combined with an aromatic group, or an alicyclic group, and their groups substituted by a halogen atom, nitro group, amino group, cyano group, methoxy group or acetoxyl group, provided that at least one of R.sup.3, R.sup.4, R.sup.5 and R.sup.6 is neither hydrogen atom nor the above-mentioned group which has 1 to 11 carbon atoms; a part of at least one of said R.sup.1 and said R.sup.2 being substituted with a group having a valence different therefrom. The precursor of the present invention can provide thin films by the LB technique, and by ring closure of the obtained LB films, there can be obtained ultrathin films having excellent heat resistance, electric properties, chemical resistance and mechanical properties, and having a thickness of not more than 10,000 .ANG., and if desired, a thickness of 10 to 1,000 .ANG.. Further, according to the process of the invention, polyimide thin films having a wide range of properties can be easily prepared. When a part of the group R.sup.2 is substituted with a trivalent or tetravalent group, the heat resistance can be improved since a ring having better heat resistance than an imide ring is formed.