The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 1991
Filed:
Feb. 09, 1989
Yoshiaki Tomisawa, Hitachi, JP;
Tadaji Satou, Hitachi, JP;
Nobuyuki Hayashi, Hitachi, JP;
Yusuke Miyamae, Hitachi, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
In this method for reduced pressure lamination of a light sensitive material in film form to a printed circuit base board, when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board under reduced pressure, a main container for carrying out the adhesion and an intake container and an exit container connected thereto are provided, the base board is supplied to the intake container set to atmospheric pressure, and thereafter the pressure in the intake container is reduced, next the base board is supplied into the main container at reduced pressure and the light sensitive material in film form is adhered to the base board, next the light sensitive material in film form is in the case that it is continuous to the dimensions of the base board, and after supplying the base board to which the light sensitive material in film form has been adhered to the exit container at reduced pressure, the exit container is set to atmospheric pressure and the base board to which the light sensitive material in film form has been ahdered is ejected from the exit container. A reduced pressure adhesion device is also described for performing the method.