The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 1991

Filed:

Oct. 26, 1989
Applicant:
Inventors:

Masaru Nikaido, Miura, JP;

Katsuhisa Homma, Kawasaki, JP;

Tadayoshi Kinoshita, Machida, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D / ;
U.S. Cl.
CPC ...
346 / ;
Abstract

A thermal head of this invention has an improved protective layer on the head surface. The protective layer comprises a compound containing Si, O, N, and a metal M (wherein M is at least one metal selected from the group consisting of Zr, Mg, and Y). The protective layer has high hardness and toughness and does not deform much nor crack if a local concentrated load acts on it during operation of the thermal head. In the thermal head of this invention, the protective layer and a high-resistance substrate comprises a material having high hardness such as a metal, an alloy, or a ceramic protect various interlayers formed therebetween. Even if a layer comprising a material having low hardness such as a heat insulating layer comprising a heat-resistant resin is included as an interlayer, deformation or a crack caused by a local stress acting on the thermal head can be prevented. The protective layer can be produced at a higher sputtering rate than that of a conventional SIALON film or the like and therefore is superior in a mass-production property.


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