The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 1991
Filed:
Nov. 14, 1989
Masaharu Takada, Osaka, JP;
Masaru Sugimori, Takatsuki, JP;
Sunstar Engineering Inc., Osaka, JP;
Abstract
A moisture-curable hot-melt adhesive composition comprising a reaction product obtainable by reacting (A) a mixture of (a) a high molecular weight thermoplastic polyester component predominantly composed of a hydroxy-terminated high molecular weight polyester containing a hydrocarbon chain with a molecular weight of 600 to 6,000 and having a molecular weight of 8,000 to 25,000 and (b) a low molecular weight polyol having a molecular weight of not more than 5,000 with (B) a polyisocyanate compound in an NCO/OH ratio of 1.4 through 3. This moisture-curable hot-melt adhesive composition is useful for the adhesion at a low temperature, and shows an excellent heat resistance and initial physical properties.