The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 1991
Filed:
May. 12, 1989
Applicant:
Inventors:
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
525426 ; 525436 ;
Abstract
A heat curable resin composition comprising (A) a polyimide and (B) a polymaleimide is excellent in heat resistance and suitable for use as a film-shaped adhesive, a laminate or a molding material.
Quick Actions:
Matuura, Hidekazu. (1991). Heat curable resin composition (U.S. Patent No. 4985509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4985509
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile