The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 1991

Filed:

Sep. 29, 1988
Applicant:
Inventors:

Masao Kameyama, Ichihara, JP;

Shigeyuki Kumagawa, Ichihara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08K / ; C08K / ;
U.S. Cl.
CPC ...
523219 ; 523466 ; 523460 ; 524514 ; 525422 ;
Abstract

Disclosed is a thermosetting resin composition comprising (a) a preliminary reaction product between a polyamino compound and an unsaturated bismaleimide compound, (b) an epoxy group-containing vinyl compound, (b') a vinyl group-free aliphatic or aromatic halogenated epoxy compound, (c) an epoxy curing agent and (d) a radical polymerization initiator as indispensable components. This composition is characterized in that the vinyl group-free aliphatic or aromatic halogenated epoxy compound as the component (b') is incorporated. This unsaturated bismaleimide type thermosetting resin composition is excellent in not only heat resistance and strength but also flame retardancy and light weight characteristic.


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