The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 1991

Filed:

Jan. 29, 1990
Applicant:
Inventor:

Toyoaki Ueno, Yamaguchi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
425595 ; 164341 ;
Abstract

A mold clamping apparatus includes a stationary platen, a movable platen, a driving device, a rotational-linear motion transmission mechanism, a braking device, and a mold clamping force applying mechanism. The stationary platen is arranged on a frame and mounts a stationary metal mold for a molding machine. The movable platen is arranged to oppose the stationary platen to move forward/backward with respect to the stationary platen and mounts a movable metal mold. The driving device moves the movable platen forward/backward with respect to the stationary platen. The rotational-linear motion transmission mechanism is arranged between the driving device and the movable platen and converts a rotational torque of the driving device into a linear motion in a moving direction of the movable platen. The braking device is connected to the driving device and brakes a linear motion of the movable platen toward the stationary platen at the end of the linear motion. The mold clamping force applying mechanism applies a mold clamping force to the movable platen upon braking of the braking device.


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