The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 1991
Filed:
May. 10, 1988
Applicant:
Inventor:
Hiroshi Matsumoto, Hyogo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 68 ; 357 71 ;
Abstract
In a semiconductor device wherein a bonding pad is formed on an electrode through an insulating interlayer and a bonding wire is bonded to the bonding pad by thermocompression bonding, a through hole for connecting the bonding pad and the electrode is formed in the insulating interlayer above a contact hole for connecting the electrode and an active region formed in a semiconductor substrate. Metal columns of members of the electrode filled in the contact hole and members of the bonding pad filled in the through hole are formed under the bonding pad.