The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 1990
Filed:
Nov. 21, 1989
Applicant:
Inventor:
David J Brownell, Maple Grove, MN (US);
Assignee:
Honeywell Inc., Minneapolis, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 40 ; 357 41 ; 357 71 ; 357 68 ; 357 65 ;
Abstract
A semiconductor device having a metal interconnect feature which comprises an array of metal features. Each of the metal features in the array has a size not substantially larger than a predetermined feature size. The metal features in the array are connected together by a metal layer deposited over the array of metal features.
Brownell, David. (1990). Semiconductor device with bonding pad contacts (U.S. Patent No. 4979012). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4979012
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile