The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 1990
Filed:
Oct. 31, 1988
Applicant:
Inventors:
Renshi Sawada, Tokorozawa, JP;
Junji Watanabe, Tokyo, JP;
Assignee:
Nippon Telegraph and Telephone Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B / ; C03C / ;
U.S. Cl.
CPC ...
65 182 ; 65 36 ; 65 43 ; 156 89 ;
Abstract
A method of manufacturing a semiconductor substrate includes the steps of performing flame electrolysis on a galss source with an oxyhydrogen flame, spray-depositing the resultant glass particles on a joint surface of a semiconductor substrate, placing another semiconductor substrate on the deposited glass particles and performing heat-treatment, and joining the two substrates by sintering the glass particles.
Sawada, Renshi. (1990). Method of joining semiconductor substrates (U.S. Patent No. 4978379). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4978379
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile