The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 1990
Filed:
Aug. 28, 1989
Applicant:
Inventors:
Julius C Fister, Hamden, CT (US);
Satyam C Cherukuri, West Haven, CT (US);
Deepak Mahulikar, Meriden, CT (US);
Brian E O'Donnelly, Branford, CT (US);
Assignee:
Olin Corporation, New Haven, CT (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; B23K / ;
U.S. Cl.
CPC ...
228123 ; 228175 ; 228254 ; 156325 ; 65 591 ; 29832 ;
Abstract
A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.