The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 1990

Filed:

Oct. 24, 1988
Applicant:
Inventors:

Tadakatsu Nakajima, Ibaraki, JP;

Heikichi Kuwahara, Ibaraki, JP;

Shigeo Ohashi, Ibaraki, JP;

Motohiro Satoh, Ibaraki, JP;

Toshihiro Yamada, Ibaraki, JP;

Kenichi Kasai, Ushiku, JP;

Satomi Kobayashi, Nagareyama, JP;

Akihide Watanabe, Tsukuba, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 82 ; 357 80 ; 357 75 ; 165 804 ; 16510433 ; 361382 ;
Abstract

Flexible cooling paths are connected to semiconductor elements which are heated members. A cooling apparatus comprises cooling blocks connected to cooling blocks, coolant flow paths through which the coolant flows, coolant branching mechanisms provided in the coolant flow paths and connecting mechanism for connecting the branching mechanism and the cooling blocks through O-rings. A part of coolant flowing through the cooling flow paths is introduced into the cooling blocks for the respective heated chips in order.


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