The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 1990

Filed:

Aug. 09, 1989
Applicant:
Inventors:

Tatsuo Okamoto, Itami, JP;

Hideo Kotani, Itami, JP;

Takio Oono, Itami, JP;

Kiyoto Watabe, Itami, JP;

Yasushi Kinoshita, Itami, JP;

Yoshikazu Nishikawa, Itami, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437190 ; 437189 ; 437194 ; 437195 ; 437203 ;
Abstract

Conductive layers (5a, 8a) included in a multi-layer structure (30a) are electrically interconnected through an conductive connection wall (13a) provided in a contact hole (12) and contacting the side surface (22) of the multi-layer structure (30a). The upper conductive layer (11a) existing on the multi-layer structure (30a) and the lower conductive layer (3) existing under the multi-layer structure (30a) are electrically interconnected through a conductive film (11b) provided in the contact hole (12). These two interconnections are insulated from each other by an insulating film (18) provided on the connection wall (13a).


Find Patent Forward Citations

Okamoto, Tatsuo. (1990). Method for manufacturing interconnection structure in semiconductor (U.S. Patent No. 4977105). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4977105

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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