The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 1990

Filed:

Feb. 19, 1986
Applicant:
Inventors:

David J Williams, Amherst, MA (US);

Louis Leung, Hong Kong, HK;

Frank E Karasz, Amherst, MA (US);

William J MacKnight, Amherst, MA (US);

Michael Jaffe, Maplewood, NJ (US);

Assignee:

Hoechst Celanese Corp., Somerville, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ;
U.S. Cl.
CPC ...
525432 ; 525435 ; 525931 ;
Abstract

Miscible compositions comprising from about 1 part by weight to about 99 parts by weight of an aromatic polyimide and from about 99 parts by weight to about 1 part by weight of an aromatic polybenzimidazole. Preferably, the composition comprises from about 5 parts by weight to about 95 parts by weight of an aromatic polyimide and from about 95 parts by weight to about 5 parts by weight of an aromatic polybenzimidazole. In a composition mostly comprised of an aromatic polybenzimidazole, it is preferred that the aromatic polyimide be thermoplastic and be present in the composition in an amount sufficient to make the aromatic polybenzimidazole more processable for molding purposes and also less susceptible to moisture. More preferably, such compositions are comprised of from about 65 parts by weight to about 95 parts by weight of an aromatic polybenzimidazole and from about 35 parts by weight to about 5 parts by weight of a thermoplastic aromatic polyimide. In a composition mostly comprised of a soluble, thermoplastic aromatic polyimide, it is preferred that the aromatic polybenzimidazole be present in an amount sufficient to render the soluble thermoplastic aromatic polyimide less sensitive to solvents, and to increase its glass transition temperature. More preferably, such compositions are comprised of from about 6 parts by weight to about 95 parts by weight of a soluble thermoplastic aromatic polyimide and from about 35 parts by weight to about 5 parts by weight of an aromatic polybenzimidazole.


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