The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 1990
Filed:
Aug. 09, 1989
Applicant:
Inventors:
Assignee:
Shin-Etsu Polymer Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29840 ; 29841 ;
Abstract
The invention relates to an improvement in the so-called flip-chip method for electrically connecting bonding pads of a semiconductor device, e.g., IC chips, and electrodes of a circuit board. In place of the conventional bumps formed of a solder alloy on the bonding pads, the bonding pads in the invention are formed of a material having electric conductivity and rubbery elasticity so that the reliability of the electric connection can greatly be improved.