The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 1990
Filed:
Apr. 17, 1989
Toyokazu Yamada, Himeji, JP;
Idemitsu Petrochemical Co., Ltd., Tokyo, JP;
Abstract
A multilayer structure comprising (C) a substrate layer, (A) a surface layer of a thermoplastic resin, and (B) an intermediate layer of a thermoplastic resin sandwiched between the (C) substrate layer and the (A) surface layer, wherein the (B) intermediate layer contains 0 to 70% by weight of a flake inorganic filler, the peeling strength between the (A) surface layer and the (B) intermediate layer is from 0.3 to 2.0 kg/15 mm, and the peeling strength between the (B) intermediate layer and the (C) substrate layer is at least 1.2 times as large as the peeling strength between the (A) surface layer and the (B) intermediate layer. When a packaging container is produced by forming the multilayer structure into a container body and sealing the container body with a lid, easy openability and high sealing property will be ensured because the opening of the packaging container is not operated by using the delamination between the sealed portion but by using the easy delamination between the surface layer (A) and the intermediate layer (B). The use of the multilayer structure for production of packages is economically advantageous because the recovered scrap can be reused as the material for the substrate layer (C) without affecting the peelability of the surface layer (A).