The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 1990

Filed:

Nov. 22, 1989
Applicant:
Inventors:

Norimasa Yamaya, Yokohama, JP;

Masahiro Ohta, Yokohama, JP;

Akihiro Yamaguchi, Kamakura, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
526262 ; 524548 ; 528170 ; 528321 ; 528322 ;
Abstract

This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: ##STR1## wherein R represents a divalent group of ##STR2## X being a direct bond or a group selected from the group consisting of divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.


Find Patent Forward Citations

Yamaya, Norimasa. (1990). Thermosetting-resin-forming composition from bis-maleimide and diallyl (U.S. Patent No. 4968762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4968762

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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