The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 1990
Filed:
Apr. 05, 1989
Applicant:
Inventor:
Satoshi Akutagawa, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03B / ;
U.S. Cl.
CPC ...
355 53 ; 355 77 ; 437226 ;
Abstract
A process for forming dicing lines on a wafer which comprises: exposing a wafer region in which a dicing line pattern has not been formed to light irradiated through and patterned by a reticle for forming dicing lines; the reticle having a nonpatterned region of the same size as a device pattern region of a reticle for forming a device pattern on the wafer and a dicing zone which is in contact with the periphery of the nonpatterned region.