The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 1990
Filed:
May. 26, 1989
Harald Cherdron, Wiesbaden, DE;
Hellmuth Deckers, Ingelheim, DE;
Friedrich Herold, Hofheim am Taunus, DE;
Reiner Hess, Wiesbaden, DE;
Hoechst Aktiengesellschaft, Frankfurt am Main, DE;
Abstract
The structure of the aromatic copolyether amide which can be processed as a thermoplastic comprises recurring units of the formulae --CO--Ar.sup.1 --CO-- (A), --NH--Ar.sup.1 --O--Ar.sup.1 --X--Ar.sup.1 --O--Ar.sup.1 --NH (B) and --NH--Ar.sup.2 --NH-- (C) in which Ar.sup.1 denotes a divalent, unsubstituted or substituted aromatic radical having 6 carbon atoms which is linked in the p-position, X represents a 2,2-propylidene link and Ar.sup.2 is identical with Ar.sup.1 or is Ar.sup.1 which is linked in the m-position, or is the --Ar.sup.1 --Z--Ar.sup.1 -- group in which Z is a direct bond or is a radical --CH.sub.2 --, --C(CH.sub.3).sub.2 --, --SO.sub.2 --, --CO--, --O--, --CH.dbd.CH--, --CO--NH-- or --O--Ar.sup.1 --O-- or the radical ##STR1## in which R represents hydrogen or a branched or unbranched alkyl radical having 1-4 carbon atoms. The proportion of units (A) and of the sum of units (B) and (C) is each 100 mol-%, the proportion of units (C) being up to 50 mol-% and, if Z represents --SO.sub.2 --, up to 75 mol-%. The Staudinger index [.eta.] of the copolyether amide is in the range from 50 to 1000 cm.sup.3 /g, and the value of the glass transition temperature is above 200.degree. C. The copolyether amide is prepared by a low-temperature solution, solid, interface or melt condensation process. The moldings produced therefrom in the form of filaments, wires, films and other moldings are obtained by processing the pulverulent copolyether amides or their solutions.