The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 1990
Filed:
Jun. 12, 1989
Applicant:
Inventors:
Satoru Ogihara, Hitachi, JP;
Hironori Kodama, Hitachi, JP;
Nobuyuki Ushifusa, Hitachi, JP;
Kanji Otsuka, Higashiyamato, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 81 ; 357 71 ; 357 72 ; 357 80 ;
Abstract
An integrated circuit package produced by bonding a rear surface of an insulating substrate enclosed in the package to a heat sink such as a cooling fin by a resinous adhesive, which may include one or more fillers, having a Young's modulus of 500 kg/cm.sup.2 or less when formed into a film, has high reliability at the bonding portion and withstands without damages even if subjected to thermal shocks.