The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 1990
Filed:
Jun. 28, 1988
Applicant:
Inventors:
Akira Sasame, Hyogo, JP;
Hitoyuki Sakanoue, Hyogo, JP;
Masaya Miyake, Hyogo, JP;
Akira Yamakawa, Hyogo, JP;
Assignee:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 81 ; 357 71 ; 357 74 ;
Abstract
A member for a semiconductor structure is constructed, for example, as a mounting, or as a cover, or as a heat sink. Such a component is obtained by joining an aluminum nitride insulating substrate and a radiating element. The metal material for forming the radiating member has a thermal conductivity of at least 120 W/mK and a thermal expansion coefficient within a range of 4 to 6.0.times.10.sup.-6 /K.sup.-1. Preferably the material forming the radiating element is made of a tungsten alloy containing copper by not more than 5 percent by weight.