The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 1990
Filed:
Apr. 27, 1989
Applicant:
Inventors:
Assignee:
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
425556 ; 264336 ; 4254 / ; 425438 ; 425444 ;
Abstract
An expansion injection molding die having a plate forming the die cavity, a backup plate, a core plate, ejector pins inserted through the backup plate and the core plate for separating the molded products from the die cavity, and a gas introducing passage communicating with the pressurized gas source for introducing gas into the die cavity. The plate that has holes through which the ejector pins are injected are formed with hollow portions. In each of the hollow portions, a guide ring is installed so that it is freely movable at least two-dimensionally. A sealing member is installed in an expanded hole portion in the guide ring so that it is in sliding contact with the ejector pin.