The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 1990

Filed:

Sep. 30, 1987
Applicant:
Inventors:

Hiroyuki Kosuda, Shizuoka, JP;

Yasuhisa Nagata, Shizuoka, JP;

Masato Andoh, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
525422 ; 525438 ; 525463 ; 525471 ; 525502 ; 525504 ; 525506 ; 525507 ; 525480 ; 525523 ; 525530 ; 525533 ; 525423 ; 523439 ; 523468 ; 523400 ;
Abstract

The resin composition which contains thermosetting resin as Component (A), a thermoplastic resin as Component (B), and at least one compound selected from the group consisting of an epoxy resin capable of dissolving the thermoplastic resin and a reactive diluent possessing at least one epoxy group as Component (C) in a ratio such that the proportions of Components (A), (B), and (C) fall respectively in the ranges of 30 to 96% by weight, 2 to 50% by weight, and 2 to 49% by weight, based on the total weight of the resin composition. The resin composition is capable of producing a molded article combining the highly satisfactory mechanical and thermal properties of a thermosetting resin and the highly satisfactory toughness of a thermoplastic resin.


Find Patent Forward Citations

Loading…