The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 1990

Filed:

Apr. 03, 1989
Applicant:
Inventors:

Henry E Geist, Scottsdale, AZ (US);

Eugene E Segerson, Tempe, AZ (US);

Assignee:

Motorola Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 81 ; 357 74 ; 357 75 ; 357 68 ;
Abstract

An improved semiconductor device package and method include, in a first embodiment, a die supporting leadframe having fingers inside the package body which are interleaved with mating fingers of a metallic heat extractor, without touching. A thermally conductive encapsulation fills the spaces between and around the fingers to provide thermal coupling and electrical isolation. The heat extractor extends outside the package body. Alternatively, the heat extractor and the leadframe have large parallel faces inside the package body which are arranged in a face-to-face relationship, without touching. An insulating spacer locks the opposing faces in the spaced-apart, electrically isolated relationship. An encapsulation fills any remaining space between the faces to provide efficient thermal coupling.


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