The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 1990

Filed:

Jun. 07, 1988
Applicant:
Inventors:

Taichi Nishio, Chiba, JP;

Hiroomi Abe, Chiba, JP;

Yasurou Suzuki, Chiba, JP;

Takashi Sanada, Chiba, JP;

Satoru Hosoda, Chiba, JP;

Takayuki Okada, Ehime, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ;
U.S. Cl.
CPC ...
525 66 ; 525 68 ; 525 92 ; 525391 ; 525396 ; 525397 ; 525905 ;
Abstract

A novel thermoplastic resin composition comprising a matrix of polyamide resin (E) and a disperse phase of a composition (D), said composition (D) comprising a polyphenylene ether (A), a rubber-like materail (B) and a mutual compatibilizer (C), said polyphenylene ether (A) being obtained from at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (A) having a reduced viscosity .eta..sub.sp/c of 0.40-0.58 deciliter/gram, said mutual compatibilizer (C) being compatible or reactive with said polyphenylene ether and reactive with said polyamide resin, and said polyamide resin (E) having a number average molecular weight of 14,000-40,000 and an end amino group content of 50-95 mmole/kg, wherein the thermoplastic resin composition constitutes 1-65 wt. % of said polyphenylene ether (A), 1-20 wt. % of said rubber-like material (B), 0.01-5 wt. % of said mutual compatibilizer (C) and 35-97.99 wt. % of said polyamide resin (E), based on the total weight of said thermoplastic resin composition, and the weight average particle size of said disperse phase is 2 micron or less.


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