The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 1990
Filed:
Apr. 29, 1988
Tadayuki Ohmae, Chiba, JP;
Tadashi Sakurai, Chiba, JP;
Noboru Yamaguchi, Chiba, JP;
Mitsuyuki Okada, Chiba, JP;
Kouichiro Asao, Chiba, JP;
Sumitomo Chemical Company, Limited, Osaka, JP;
Abstract
A conductive plastic molding obtained by melt molding an ethylene copolymer comprising from 40 to 90% by weight of an ethylene unit, from 10 to 60% by weight of at least one dialkylaminoalkylacrylamide comonomer unit represented by formula ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 and R.sub.3 each represents an alkyl group having from 1 to 4 carbon atoms; and n represents an integer of from 2 to 5, and up to 20% by weight of one or more ethylenically unsaturated comonomer units and having a number average molecular weight of from 5,000 to 50,000 and impregnating at least 10 parts by weight of an aqueous solution of at least one of an organic acid, an inorganic acid, and an inorganic metal salt into 100 parts by weight of the resulting melt molded. The molding exhibits excellent conductivity and can be obtained easily and at low cost without any limitation on shape.