The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 1990
Filed:
Aug. 24, 1989
Richard J Hoppe, Rockford, IL (US);
Steven E Jackson, Rockford, IL (US);
William K Anderson, Rockford, IL (US);
Sundstrand Corporation, Rockford, IL (US);
Abstract
A compression loaded semiconductor device package (40) in accordance with the invention includes a cylindrical semiconductor device (54) having a first region (66) on a first face, a control region (68) on the first face having a central portion (70) and a plurality of projections (72) extending radially from the central portion with the radial projections being symmetrically disposed around the periphery of the first face and a second region (74) on a second face with the second face being opposed to the first face; an electrically conductive contract (48) having an external control terminal (88), an annulus (84) electrically connected to the external control terminal, a plurality of projections (82) electrically connected to the annulus, projecting radially inward and a center (80) electrically connected to the radially inward projections and to the control region; and first and second annular insulators (112 and 114) each insulator having a plurality of faces, the upper cover being bonded to a first face (116) of the first insulator, a second face of the first insulator being bonded to a first attachment ring (122) with the first attachment ring being bonded to the annulus, the lower cover being bonded to a first face (116) of the second insulator, a second face (118) of the second insulator being bonded to a second attachment ring (124) with the second attachment ring being bonded to the annulus, the bonds (120) defining a sealed chamber containing the semiconductor device.