The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 1990
Filed:
Feb. 01, 1988
William D Carlommagno, Redwood City, CA (US);
Dennis E Cummings, Placerville, CA (US);
Alexandru S Gliga, San Jose, CA (US);
Raychem Corporation, Menlo Park, CA (US);
Abstract
A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulting material. The wire may be bonded to the contact on the first component by means of a wire bonder having a bonding head which weakens or severs the wire to the desired length.