The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 1990
Filed:
Dec. 27, 1989
Eiki Takeshima, Chiba, JP;
Kiyoshi Takatsu, Chiba, JP;
Youichi Kojima, Hyogo, JP;
Takahiro Fujii, Chiba, JP;
Nisshin Steel Co., Ltd., Tokyo, JP;
Abstract
Disclosed herein suspension electroplating of fine particles with metal. An electroplating operatively equipped with a cathode and anode is charged with a a metallic ion-containing electrolyte and particles to be electroplated. The particles have a size of from 0.1 to 10 .mu.m. At least a part of the surface of each particle is conductive. Such a stationary circulating flow of a suspension of the particles in the electrolyte is formed in the bath that the particles are maintained in the suspended condition; the suspension is circulated substantially without coming in contact with the anode; the particles may have a chance of colliding with substantially all surface areas of the working surface of the cathode, and are repeatedly brought in collision with the cathode at a velocity with a normal component of from 0.6 to 6.0 m/min; and a particle concentration of the suspension at the time of collision is from 30 to 55% by volume. When such a stationary flow has been formed, a current for electroplating is caused to pass, whereupon deposition of metal on the particles proceeds without deposition of the particles and metal on the cathode.