The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 1990
Filed:
May. 17, 1989
Paul J Conn, Grand Island, NY (US);
S. A. Day Manufacturing Co., Inc., Buffal, NY (US);
Abstract
A new and improved solder tinning paste composition suitable for use as an underlay for metallic solder when solder filling base metal braze joints to facilitate formation of the solder joint between the base metals. The paste composition comprises substantially pure tin powder, suspending agent, inorganic based flux and solvent. Optionally, the paste composition may comprise a deoxidizing agent, a soil removing agent and a surfactant. The solder tinning paste exhibits enhanced flowing and wetting characteristics and a lower melting point. In another aspect thereof, the present invention provides a process for formulating the foregoing solder paste composition.