The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 1990
Filed:
Jun. 30, 1989
Maurice G Fey, Plum Borough, PA (US);
Natraj C Iyer, Monroeville, PA (US);
Alan T Male, Murrysville Boro, PA (US);
William R Lovic, New Kensington, PA (US);
Westinghouse Electric Corp., Pittsburgh, PA (US);
Abstract
High density compacts are made by providing a compactable particulate combination of Class 1 metals selected from at least one of Ag, Cu and Al, with material selected from at least one of CdO, SnO, SnO.sub.2, C, Co, Ni, Fe, Cr, Cr.sub.3 C.sub.2, Cr.sub.7 C.sub.3, W, WC, W.sub.2 C, WB, Mo, Mo.sub.2 C, MoB, Mo.sub.2 B, TiC, TiN, TiB.sub.2, Si, SiC, Si.sub.3 N.sub.4, usually by mixing powders of each, step (1); uniaxially pressing the powders to a density of from 60% to 95%, to provide a compact, step (2); hot densifying the compact at a pressure between 352 kg/cm.sup.2 (5,000 psi) and 3,172 kg/cm.sup.2 (45,000 psi) and at a temperature from 50.degree. C. to 100.degree. C. below the melting point or decomposition point of the lower melting component of the compact, to provide densification of the compact to over 97% of theoretical density; step (3); and cooling the compact, step (4).