The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 1990
Filed:
Jul. 01, 1987
William J West, Los Altos, CA (US);
Howard H Taub, San Jose, CA (US);
Robert J Miller, Burlingame, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
An orifice plate is thermally bonded to a thick film photopolymer spacer fabricated on a print head substrate using heat and compression. The compression is applied by pressurized gas to a pliable sheet covering the orifice plate and substrate assembly. Heat can be supplied through a vacuum chuck on which the assembly is mounted or from a heating element embedded in the pliable sheet. An apparatus comprising an air actuated ram with a flange having an o-ring seated within is used to seal the pliable sheet against the vacuum chuck circumferentially about the assembly. The ram includes a chamber with an open end which is sealed against the pliable sheet when in an engaged position. By filling the chamber with gas under sufficient pressure while heating the spacer forms a bond between the orifice plate and the assembly. After thermal bonding, curing of the photopolymer spacer can be completed in an oven.