The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 1990
Filed:
May. 08, 1989
Hidetoshi Yokoi, Tokyo, JP;
Mikiya Niwa, Urawa, JP;
Yasuo Nomura, Toyama, JP;
Takeshi Takahasi, Toyama, JP;
Nissui Kako Co., Ltd, Saitama, JP;
Nachi-Fujikoshi Corporation, Toyama, JP;
Abstract
A method for degating an injection molded article comprising the steps of filling a mold cavity with a molten resin and cooling the mold to effect gate seal. A gate cut shaft member is oscillated after gate seal is completed to soften the hardened resin in the gate. The gate cut shaft member is then displaced with respect to the mold cavity when the resin is softened to effect degating. A second method comprises the steps of cutting the gate in the molded article by sliding the gate cut shaft member during the dwell process with respect to the mold cavity after filling the mold with molten resin and before gate seal is effected. While said gate cut shaft member is subject to minute oscillation or a slow reciprocating motion, the shaft surface is abutted against the degated surface to obtain a good cut surface on the molded article.