The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 1990
Filed:
May. 30, 1989
Applicant:
Inventors:
Hironobu Okino, Kawasaki, JP;
Akio Fujiwara, Chigasaki, JP;
Yutaka Akiba, Fujisawa, JP;
Susumu Kasukabe, Yokohama, JP;
Tsuyoshi Fujita, Yokohama, JP;
Masao Mitani, Yokohama, JP;
Kazuo Hirota, Chigasaki, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C23F / ; C03C / ; C03C / ;
U.S. Cl.
CPC ...
156630 ; 156626 ; 156634 ; 156643 ; 156652 ; 156656 ; 1566611 ; 20412965 ;
Abstract
A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.