The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 1990
Filed:
Sep. 30, 1988
Soong H Lee, Potomac, MD (US);
Chun L Lau, Colorado Springs, CO (US);
Daniel C Buck, Hanover, MD (US);
Dale E Dawson, Glen Burnie, MD (US);
Westinghouse Electric Corp., Pittsburgh, PA (US);
Abstract
The invention is an improved integrated circuit chip assembly which provides enhanced heat transfer from active electronic devices of the integrated circuit by significantly reducing the thickness of the substrate and providing the necessary structural support through a thermally conducting spacing segment between the substrate and a ground plane in the region of the active electronic devices. This improvement further permits added flexibility in the design of transmission lines by permitting adjustment of the distance between the transmission line and the ground plane and furthermore by permitting the introduction of a second dielectric material such that the impedance of the transmission line may be controlled.