The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 1990

Filed:

Aug. 12, 1988
Applicant:
Inventors:

Tadashi Imanaka, Odawara, JP;

Tetsuo Kobayashi, Ashigarakami, JP;

Harunobu Saito, Odawara, JP;

Osamu Hirai, Odawara, JP;

Kanji Kawakami, Mito, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B / ; G11B / ;
U.S. Cl.
CPC ...
360126 ; 360123 ; 360125 ;
Abstract

In a thin-film magnetic head having a magnetic core (upper magnetic layer), in the electromagnetic conversion section, which are composed of an upper first magnetic film, inorganic insulating film, and an upper second magnetic film, the upper first magnetic film is used as a second wiring for electrical continuity between the coil and input/output terminal. The upper first magnetic film is connected to the center of a coil which is of a single-layer structure. The first upper magnetic film is made of a same material as the coil and is formed simultaneously with the latter. In the region in which an input/output terminal backing is formed, the upper first magnetic film of a second wiring is removed. Thus, the electrical continuity is established between the input/output terminal and the center of the coil. Also, the utilization of the upper first magnetic film as second wiring is applicable to a thin-film magnetic head having a coil of a multi-layer structure.


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