The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 1990
Filed:
Dec. 16, 1988
Applicant:
Inventor:
Jun-ichi Ohno, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 68 ;
Abstract
A semiconductor device is provided with a plurality of inner leads substantially radially arranged around a pellet mounting area of a lead frame, an insulating sheet arranged on the pellet mounting area so as to adhesively fix inner lead tip portions, and a semiconductor pellet mounted on the insulating sheet, wherein each tip portion of at least every other inner lead is provided with a broader portion broader than the width of each of the other inner lead tip portions, the broader portion is positioned closer to the central portion of the lead frame than the other inner lead tip portions, and an opening or a thin portion is provided within the broader portion.