The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 1990
Filed:
Nov. 08, 1988
Nippon Steel Corporation, Tokyo, JP;
Abstract
Disclosed is a process for preparing a thin grain oriented electrical steel sheet having a final thickness of 0.05 to 0.25 mm from a silicon steel slab comprising 0.050 to 0.120% by weight of C, 2.8 to 4.0% by weight of Si and 0.05 to 0.25% by weight of Sn, wherein the starting silicon slab further comprises up to 0.035% by weight of S and 0.005 to 0.035% by weight of Se, with the proviso that the total amount of S and Se is in the range of 0.015 to 0.060% by weight, 0.050 to 0.090% by weight of Mn, with the proviso that the Mn content is in the range of {1.5.times.[content (% by weight) of S+content (% by weight) of Se[} to {4.5.times.[content (% by weight) of S+content (% by weight) of Se[} % by weight, 0.0050 to 0.0100% by weight of N, and {[27/14].times.content (% by weight) of N+0.0030} to {[27/14].times.content (% by weight) of N+0.0150} % by weight of acid-soluble Al.